Showing results: 31 - 45 of 60 items found.
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VS6845E -
Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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EVG®20 -
EV Group
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Yamashita Denso Corp.
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
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PVA TePla Analytical Systems GmbH
The fully automated acoustic microscopes from the SAM Auto Line enable simple detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. The results can be issued as klarf files and VEGA MAP. A GEM/SECS connection is also possible.
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NorCom 2020-WL -
NorCom Systems Inc.
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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WL150 and WL200 -
McBain Systems
The McBain WL150 and WL200 Series Wafer Handler is a safe, semi-automatic wafer loader designed to use with virtually all major microscopes, optics and inspection devices. It is a portable, economically priced tool which serves as a direct replacement for the Irvine Optical Ultrastation systems. The WL Wafer Handler, available in two configurations to handle 3" to 6" wafers or 4" to 8" wafer sizes, is designed for easy operation, seamless integration, and consistent, reliable handling for labs and automated workstations.
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ASML
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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MXI Quadra 7 -
Nordson Corporation
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Ismeca NY32W -
LTX-Credence
32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.
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UNIVANS Co., Ltd.
The semiconductor manufacturing process is divided into a front process (WAFER) and a post process (PACKAGE). The LOAD BOARD is an INTERFACE device for inspecting the function and performance of a package state IC, which is a post process, It is an INTERFACE key device for inspection. In particular, LOAD BOARD is widely used in non-memory semiconductor inspection equipment.
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NSX -
Onto Innovation
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Ismeca NY32W -
Cohu, Inc.
32-position turret test and scan platform for semiconductors on film-frame wafer media, providing the highest inspection yield for WLCSP and Bare Dies. Integrating innovative hardware and software technologies such as intelligent features that enable extended autonomous operation and productivity.
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NovusEdge -
Onto Innovation
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Camtek Intelligent Imaging
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Recif Technologies Inc.
The NFE200 is a single stage tool that aligns wafers by the notch and elevates them for inspection by the Operator.Wafers are aligned using the heavily industrialised alignment technology developed by RECIF Technologies and used in the field for 10+ years. The final position can be selected through the User Interface.