Showing results: 211 - 225 of 427 items found.
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Model DRIE-1200-LL-ICP -
TEK-VAC INDUSTRIES Inc.
Single process chamber for high rate plasma etching of 200mm wafers. Loadlocked. Stainless steel construction. Capabilities of smaller, multiple wafer throughput. Substrate materials include (but are not limited to) silicon, silicon oxynitrides, SiC, SiGe, Aluminum, and III-V compounds including GaAs, GaN, GaP, and InP. Stable plasma generation capabilities to below 1 mTorr. Five, Six, or Eight gas mass flow controllers are standard. Expanded or reduced numbers are available upon request.
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E4727B -
Keysight Technologies
Get a deeper, closer look at low frequency noise with the A-LFNA integrated with WaferPro Express, featuring data analysis, wafer prober control and test suite automation.
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Tokyo Seimitsu Co., Ltd.
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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VEGA Series -
MPI Photonics Automation
MPI VEGA Prober series is ready to meet the diverse test and material handling requirements of the Laser Diode (VCSEL, EEL) and optical module markets. MPI VEGA probers are based on a highly flexible and reliable platform, enabling the test of a wide variety of device types (Wafer, Package & Singulated Die) over temperatures with the ability to handle thin/warped wafers. Multiple probing schemes are also supported with the ability to probe small pads with well-controlled needle force.
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Reedholm Systems
Reedholm has configured an integrated system, not just a set of boxes, for testing high power devices at the wafer level. Sophisticated testing, prober control, and database management do not carry a programming burden. As a result, fast, automated wafer testing is done in an inexpensive, compact probing platform.
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MICROLINE AF -
VIEW Micro-Metrology
The VIEW MicroLine® is a high-performance critical dimensional measurement system for wafers, masks, MEMS and other micro-fabricated devices in situations which do not require fully automated operation.
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MPI Advanced Semiconductor Test
manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.
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VC Series -
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
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400SW -
Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection.
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LIGHTiX -
Unity Semiconductor SAS
Next generation macro inspection system (AOI).• All-side wafer inspection: Front, back and edge inspection.• 100% defect images without throughput impact.• Integrated high-end microscope review.• True Color Inspection (TCI) technology.• Advanced CD, 2D/3D, OVL and EBR metrology.• Automatic defect classification• Best in class cost of ownership for high resolution AOI• High-speed patterned wafer inspection• High defect sensitivity• ISO Class 1 certified• Tool – to – tool matching
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Brooks Automation, Inc.
The Brooks field-proven wafer transport robots and modules deliver high performance and low total cost of ownership to create manufacturing efficiency, accelerate innovation, and drive profits for today’s manufacturers.
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PN-50α -
NAPSON Corp.
*Principle: Photovoltaic effect by light pulse irradiation*No damage and no stain by Non-contact method*Possible to check even oxidized film on wafer surface*Instantly discrimination by optical pulse illuminate
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Tokyo Seimitsu Co., Ltd.
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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MX 152 -
E+H Metrology GmbH
To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.