Showing results: 256 - 270 of 427 items found.
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Camtek Intelligent Imaging
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Recif Technologies Inc.
The NFE200 is a single stage tool that aligns wafers by the notch and elevates them for inspection by the Operator.Wafers are aligned using the heavily industrialised alignment technology developed by RECIF Technologies and used in the field for 10+ years. The final position can be selected through the User Interface.
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GEN3000T -
Toray Engineering Co., Ltd.
GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Minitile™ with Advanced Cantilever™ technology and WedgeTile™ -
Celadon
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Model MPS-2000 -
TEK-VAC INDUSTRIES Inc.
Accurate linear wafer transporter with low particulate generation. Automated options with programmable controls. Safety interlocked with local and global interfaces. Base pressures to 10-8 torr. Optional clean room load lock entry port. Option for inductively coupled plasma processing is available. Complete and ready to operate.
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Precision Development Consulting Inc
Automation of new process tool prototype in startup environment, Complex R&D Gasbox Automation, Semiconductor System Control Software, Wafer Transfer Control Software, 300mm Factory Automation, Complete port of Spectrometer software to windows, HSMS Protocol
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OHT Inc.
*This system can measure MRAM characteristics automatically.*Generates strong and constant magnetic fields. (Max 1.5T, the highest in the industry)*Performs high speed sweep of magnetic field by using non-magnetic materials wafer chuck. (Max 4Hz, ±1T, the highest in the industry)
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E3640 -
Advantest Corp.
Ongoing semiconductor process shrinks are driving new demand for stable, highly precise measurement of pattern dimensions for photomask and wafer production. The E3640 satisfies these requirements with industry-leading precision measurement capabilities and upgraded functionality that enhances mask R&D and production efficiency.
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R2D Automation
ID Reader 8″ is the best tool to avoid lot errors. Designed for using 200mm – 8″ notch aligner and OCR system, it checks your carrier tag, reads each wafer scribes, then sends the information to your Host with SECSII Gem commands
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Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Model CRX-4K -
Lake Shore Cryotronics, Inc.
The Model CRX-4K is a versatile cryogen-free micro-manipulated probe station used for non-destructive testing of devices on full and partial wafers up to 51 mm (2 in) in diameter.
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Model TTPX -
Lake Shore Cryotronics, Inc.
The Model TTPX is a versatile cryogenic micromanipulated probe station used for non-destructive testing of devices on full and partial wafers up to 51 mm (2 in) in diameter.
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Model FWPX -
Lake Shore Cryotronics, Inc.
The Model FWPX is a versatile cryogenic micro-manipulated probe station used for nondestructive testing of devices on full and partial wafers up to 102 mm (4 in) in diameter.
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iS-G1 -
BT Imaging Pty Ltd
The iS-G1 is a full line speed optical module for the inspection of crystal grains.Using our new grain imaging technology, the iS-G1 is able to inspect as cut wafers at full inline speed with no need to stop the conveyor belt. Automated algorithms analyze the grains and report metrics.
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SpringTouch -
SV Probe, Inc.
Wafer Level Chip Scale Package is fast becoming popular because of its small form factor utilized in such applications as Wifi, Bluetooth and GPS units. The WLCSP is also very cost-effective with a simplified manufacturing process that eliminates the need for the final or package test step..