Showing results: 346 - 360 of 427 items found.
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TableTop Shadow Moiré (TTSM) -
Akrometrix, llc
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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FilmTek 2000 -
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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EV Group
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps. EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
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Anton Paar GmbH
Surface analysis is a vital method for qualifying new materials in technical and biological applications. Surface charge analysis empowers users to closely monitor the surface chemistry from small particles in the nanometer range up to large wafers. Gain insights into modifications resulting from surface treatment and surface interactions with natural environments under near-ambient conditions. Get a competitive edge in optimizing existing products and developing new ones using the Anton Paar instruments which offer zeta potential measurement for a wide range of applications.
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Production Triangular Voltage Sweep (TVS) Option -
Materials Development Corporation
In traditional TVS measurements, the operator must select the end points of the mobile ion peak todetermine the area to analyze. Though the selection of these points is a simple matter for the operator, the required input precludes using this technique in asemi-autonomous production environment. The goal of TVS Production testing is the rapid determination of mobile charge concentration with little or no operator input. The test methodology must be compatible with production environments where accuracy, easeof use, and minimum operator involvement are of paramount concern. Also, the possibility of automated wafer handling must be considered.
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VC20E Series -
Celadon Systems, Inc.
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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SemiProbe
SemiProbe has developed probe stations for a wide variety of optoelectronic and photonic device applications, including light emitting diodes (LEDs), vertical cavity surface emitting lasers (VCSEL) and photo diodes. Testing and handling small, fragile, thin wafers with thousands of die on them poses unique challenges that require innovative solutions.
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Echo VS -
Sonix Inc.
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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DDR200/300 NIR -
McBain Systems
The McBain DDR200 NIR (for 200mm) and DDR300 NIR (for 300mm) provide high-speed defect detection and precision measurement on wafers and other parts. These cost-efficient systems offer unique advantages for both production and process development use, providing an optimum near-infrared (900-1700nm) solution when both subsurface defect detection and dimensional metrology are required.
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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WGNS -
Farran Technology Ltd
The system allows the user to extend the frequency range of the NFA to allow for accurate noise figure measurements to be performed on a device operating in the 26.5 – 170GHz range on wafer as well as in benchtop applications. Farran offers the WGNS series of noise sources to be used in conjunction with the FBC down converters for use as frequency extenders for noise figure measurement test system.
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RT-3000/RG-2000 (RG-3000) -
NAPSON Corp.
*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
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Texas Instruments
digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full 40C to +125C temperature range.
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Junction Measurement and Analysis -
Materials Development Corporation
A comprehensive set of analyses for junction diode or Schottky barriers begins with C-V data gathering that adjusts the voltage step to the slope of the C-V characteristics. This assures an optimum set of C-Vdata whether the voltage range is small or large. Doping profile and resistivity profile are both available at the touch of a key. Plots of 1/C2 - V or Log(C) - Log (V+ phi) show doping uniformity and doping slope factor. Exclusive recalculation options allow adjustment of stray capacitance and area to facilitate calibration using a standard reference wafer of known doping or resistivity.
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Optosolar GmbH
Optosolar offers solar simulators with continuous light for small area solar cells (ca. 10mm x 10mm). depending on the cell size, the concentration ratio can exceed 1000 suns. Special designs cover low concentration on large area wafers (156mm x 156mm), as well as line focus applications (e.g. 8mm x 156mm at 8 suns). Flashlight Solar Simulators have the advantage of negligible temperature change to the solar cell. For this reason, they are often used for very high concentration ratios or for multijunction cells in a solar simulator with adjustable spectrum.
