Showing results: 391 - 405 of 427 items found.
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Loresta GP -
OAI
The Loresta GX Meter is an intelligent, multi purpose low resistivity meter equipped with software that calculates resistivity correction factors. A variety of 4 pin probes are available for use with the Loresta GX. The instrument is typically used in Product Engineering, R&D, and Quality Control. Applications include measurement of conductive paint, conductive plastics, conductive rubber, conductive film, silicon wafers, antistatic materials, EMI shield materials, conductive fiber, conductive ceramics, etc.
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MPI Probe Card Technology
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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T5835 -
Advantest Corp.
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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KLA-Tencor Corp
An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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InfraScan™ 400TDM -
Checkpoint Technologies, LLC.
The InfraScanTM 400TDM is the newest evolution of Checkpoint's pioneering top-down laser scanning and emission tools. This tool is specifically designed to accommodate any commercially available probe station, up to 300 mm wafers. The combination of Checkpoint Technologies, world leading laser scanning microscope and its best in class emission system into a single tool, gives users the most sensitive and easy to use system on the market. The TDM can be configured with up to 3 lasers and a choice of InGaAs, MCT or Si CCD emission cameras.
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MTS1000i -
Applied Test Resources
The MTS-1000i is lowest cost platform available in the MTS series of ATE. It has a reduced platform size compared to the MTS-2010i & MTS-1020i, reduced power supplies, and 4 slots. It is mainly intended for single site testing. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process
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TOP Cool -
Mechanical Devices Ltd.
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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MX63 / MX63L -
Olympus Corp.
The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you need to tailor the system to your application. These ergonomic and user-friendly microscopes help increase throughput while keeping inspectors comfortable while they do their work. Combined with OLYMPUS Stream image analysis software, your entire workflow, from observation to report creation, can be simplified.
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Imapact 7BT -
Lorlin Test Systems
The 7BT Benchtop Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The 7BT automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability. The system tests most all discrete semiconductors with reliable, accurate, and repeatable results and uses a Windows 10 64-BIT Operating Systems and a USB 2.0 Interface.
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HE-960LF / FS-09F-1/2 -
HORIBA, Ltd.
It is effective to keep the dilution of Slurry constant. Maintaining an appropriate conductivity value contributes to process stability in the wafer polishing process. Even highly viscous sample liquids such as CMP Slurry can be measured without problems because they use a sensor structure that reduces the risk of the sample liquid sticking to the electrodes. In addition, the sensor is made of a wetted material with excellent chemical resistance, which meets the cleanliness requirements of semiconductor processes. In addition to the above, it can also be used for introduction at the semiconductor process development stage and conductivity control of special chemicals.
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TLP-12010A -
High Power Pulse Instruments GmbH
- High pulse output current up to ±120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical 300 ps rise time- Wafer, package and system level TLP and HMM testing- 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 digital programmable pulse rise times out of: 300 ps to 50 ns (optional)- 1 built-in pulse width: 100 ns- Optional external pulse width extensions from 5 ns to 500 ns using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient software for system control and waveform data management- The software can control automatic probers for fast measurements of complete wafers- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface
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EVG®50 -
EV Group
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Model 640 -
TREK, INC.
Trek’s Model 640 Electrostatic Chuck Optimizer system is a diagnostic tool which enables evaluation and optimization of waveforms/voltages for electrostatic chucks/clamps in order to minimize de-clamp time, maximize clamp force, and achieve optimum wafer processing for ESC systems. Model 640 combines two amplifiers (for two-phase voltage combinations) and a waveform generator, which can be independently programmed and configured to investigate, research, and discover the perfect power supply and waveform recipe to efficiently drive an ESC application. An electrostatic voltmeter (ESVM) is included to monitor residual voltage from the clamping/de-clamping process.
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Keysight Technologies
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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EV Group
Increased demand for applications based on thin wafers and thin microelectronic-substrates result in the need for processing and handling of thin- and ultra-thin substrates during the manufacturing step. Thin substrates in the area of IC manufacturing (like memory, CMOS, 3D-TSV integration or ChipCard applications), power devices (e.g. IGBTs), compound semiconductors (e.g. for high brightness LEDs or RF-power amplifiers), as well as emerging technologies that also involve thin or flexible substrates (MEMS; RFID-tags, flexible displays, etc.) require reliable handling and support techniques in order to ensure safe processing.
