Grinding and Dicing Services, Inc.
Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D.
- 408 451 2000
- 408 451 2001
- info@wafergrind.com
- 925 Berryessa Road
San Jose, CA 95133
United States
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Backgrinding & Stress Relief
Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.