Four Dimensions, Inc.
We manufacture advanced semiconductor probing systems since 1978. Our Four Point Probe and CVmap systems are found in hundreds of fabs and research institutions around the world. Our CVmap systems perform capacitance-voltage ( CV ) and current-voltage ( IV ) measurements directly on the unmetalized wafer using a uniquely designed mercury probe, which allows for a wide range of Hg probe geometries. We provide four point probes with an extended measurement range or sophisticated electronics for compound semiconductors. Our latest innovation is a mercury four point probe that meets the requirements of sheet resistance measurements of ultra shallow junctions. We also offer measurement service.
- 510.782.1843
- 510.786.9321
- info@4dimensions.com
- 3140 Diablo Avenue
Hayward, CA 94545
United States
Filter Results By:
Products
Applications
-
product
Mercury Four Point Probe
Based on decades of experience with needle four point probes and C-V, I-V Mercury probing stations, Four Dimensions developed a Mercury four point probe (patent pending). The liquid metal Mercury is used to form temporary electrical contacts at four terminals. These probes cause no damage to the sample and permit no contact pressure probing.
-
product
Needle Four Point Probe
Our four point probes measure the sheet resistance / resistivity / thickness of a wide variety of materials including group-IV semiconductors, metals, and compound semiconductors, as well as new materials found in flat panel displays and hard disks. We offer a wide range of models, options, and probe heads to suit your materials', measurement, and budget needs.
-
product
Mercury Probe for CV IV Measurements
Four Dimensions' Mercury Probe Systems use the liquid metal Mercury to form temporary non-damaging electrical contacts on numerous materials. The instantaneous contact formed on semiconducting materials can be of MOS, MIS, or Schottky barrier type. This permits various electrical characterizations of for example silicon and compound semiconductors without the need of metal deposition processes.
