Semiconductor Test
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
Topics
- Semiconductor Test
- Test
- Semiconductor
- Semi-conductor
- Automated Test Systems
- System Level Test
- Test Development
- System Test
- Test Applications
- Test Cards
- Test Engineering
- Test Platform
- Test Probes
- Test Sockets
- Test Systems
- Application Development
- Probe Cards
- Probe Systems
- Development
- Cards
- Contacts
- Level
- Probes
- Quality
- Reliability
- Sockets
- Systems
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product
Test Sockets
Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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product
WLCSP Probe Heads
Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
