Showing results: 1 - 12 of 12 items found.
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M-DW1 -
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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FilmTek 2000 PAR -
Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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128 Series -
Frontier Semiconductor, Inc,
Bow and Global Film Stress Measurement.Non-contact full wafer stress mapping for semiconductor and flat panel application.Dual Laser Switching Technology.
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k-Space Associates, Inc.
For use on Veeco K465i and EPIK700 MOCVD reactors, the kSA Scanning Pyro performs automated temperature mapping in order to measure temperature variations across wafer carriers and wafers. Use it to tune heater zones and optimize process and hardware to achieve higher yields, wafer uniformity and device performance.
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SURFTENS WH 300 -
Optik Elektronik Gerätetechnik GmbH
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.New: with SECS/GEM Interface!
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SemiProbe
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Element -
Onto Innovation
The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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FilmTek 2000 -
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.TFProbe wafer measurement systems, TFProbe WM series, measure wafer thickness, warp, bow, flatness, step/bump height, trench depth. TFProbe WM systems are based on confocal optical method with advantages of non-contact, non-destructive, long working distance, fast data acquisition, full mapping functions. Particularly, with integration with our thin film measurement technique, a total solution for thickness measurement covers from a few angstroms to several millimeters. Another key feature is that all our tools are upgradable in future.
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Genmark Automation
- Control of versatile robotic structures, including "yaw", "pitch" and "roll" motion capabilities- S-curve velocity profiling, based on polynomial splines and Bernstein-Bezier curves- Continuous path control in multi-segment smooth trajectories- Synchronization of multiple axes- Trajectory control with user defined velocity profiles- Kinematical modeling of open and closed loop mechanisms- Singularity consistent path planning and singularity avoidance- Optimal PID filter tuning- Automatic adjustment with respect to the surrounding equipment (cassettes, process stations, etc.)- Tilting capabilities in terms of the end-effector frame- Compensation for deflection of the end effector, the manipulated object and geometric in accuracies of the arm Scanning and Aligning Features- Wafer mapping based on through-beam or reflective sensors- Automatic detection of the planarity and the center of wafers and FPD- Non contact FPD aligning. Misalignment compensation on the fly Safety- Programmable travel limits- Position tracking error detection- Amplifier overload protection- Emergency stop
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SE Series -
Angstrom Sun Technologies, Inc.
Spectroscopic Ellipsometer SE series are advanced models built by Angstrom Sun Technologies Inc. There are many more advantages over reflectometers due to its capability to acquire more set of polarization information at different incident angles spectroscopically. User can select two different data acquisition mode, scanning wavelength by wavelength detecting mode or array based fast detecting mode. Thanks for newly developed, mature array based detecting techniques, advanced data acquisition and processing algorithm, users are able to choose array based systems to have the same precision as scanning single element configurations. When a fast measurement is must, especially for real time in-situ measurement, mapping across big surface like wafers, array based configuration is always recommended. You are always welcome to discuss with us on your applications and we'll ensure the final configuration will meet your needs.
