Showing results: 1 - 11 of 11 items found.
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TR7007 -
Test Research, Inc.
The TR7007 ultra-high-speed 3D Solder Paste Inspection adopts the Fringe Pattern Technology and dual light source, can solve the shadow and reflection problem simultaneously. It is equipped with a linear motor and linear scale that provides a highly accurate X-Y Table system.
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aSPIre 3 -
Koh Young Technology
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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PI Series -
Vi Technology
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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TR7007 SII -
Test Research, Inc.
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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TROI 7700 SERIES -
Pemtron Co., Ltd
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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3Si Series -
Saki Corporation
Saki's 3D SPI identifies critical defects and assists with process improvement.
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YSi-SP -
Yamaha Motor IM
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Marantz Electronic Ltd.
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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MV-3L -
MIRTEC Co., Ltd.
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-BEAM® Laser Inspection System- 3D Co-Planarity Inspection of BGA and CSP Devices- Enhanced 3D Solder Paste Height Measurement Capability - INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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MV-6e -
MIRTEC Co., Ltd.
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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SE Series -
ASC International, Inc.
The CyberOptics SE Series offers the most accurate and repeatable, high speed 3D solder paste inspection in the market today. Utilizing the most advanced sensing technology, CyberOptics SPI products will provide manufacturers the reliability needed to compliment your overall screen print process improvement strategy.
