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- Pickering Interfaces Inc.
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Surface Mount Reed Relays from Pickering Electronics
Pickering Electronics Surface Mount Reed Relays contain the highest quality instrumentation grade reed switches making them suitable for the most demanding applications and are suitable for infra-red or vapor phase reflow soldering.
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Compact Reflow Checker
RCP-200
Unprecedented miniature size, high precision, stable, and well-reproducible temperature control of reflow furnace. Proprietary "Heat Resistant Micro Connector" makes it possible to measure at 6 points.
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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High Carbon Process Carrier Pallets
Composite Family
High Strength, high temperature, semiconductive composite board designed for use as circuit board and flex circuit carrying pallets for solder reflow ovens.
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Process Carrier Pallets
Metalic Family
Process carrier pallets to carry the circuit boards through pick-n-place, IR reflow, gold wire bonding, epoxy dot encapsulating, and final fuctional test. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets. Process carrier pallets can be designed to carry your circuit boards through assembly, wash and final test.
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Reflow Simulator
SRS-1C
Reproduce the temperature profile of Reflow oven. Can observe the melting state of solder paste.
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Reflow / Wave Solder Process Dashboard
Vantage
Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.
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Smart Optimization
A reflow oven or wave solder machine is capable of literally billions of alternative setups. Each combination of zone temperatures and conveyor speed will produce a unique profile for a processed product. KIC's software makes an exhaustive analysis of all the setups and it recommends the very best oven/machine recipe within seconds.
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Thermal Profiler
KIC K2
The latest-generation mobile-friendly profiling technologyThe KIC K2 Thermal Profiler features a compact and robust design that allows it to fit through the tight, heated chambers of lead-free reflow ovens. A plug-and-play hardware and graphical user interface makes profiling both quick and easy. The profile data measured by the K2 can now be viewed on either a PC or on a mobile device using the Profile Viewer App.
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Polymer Aluminum
SP-Cap™
Panasonic Industrial Devices Sales Company of America
Panasonic’s industry leading SP-Cap™ Polymer Aluminum Capacitors, are Surface-Mount (SMT) Capacitors that utilize a conductive polymer as their electrolyte material in a layered aluminum design. SP-Cap Capacitors are primarily used as input and output Capacitors for DC/DC converters due to ultra-low ESR values, high voltage options and the ability to withstand high reflow temperatures. These Capacitors are free from temperature drifts, offering capacitance values up to 560µF and voltage values ranging from 2V to 25V.
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10-Zone SMT Reflow Oven
CR10000
10 fully controlled upper and lower convection heating zones allow the CR10000 SMT reflow oven to provide you with a thermal accuracy of ±1˚C. Manncorp’s low-velocity, low-turbulence air flow options produce an even ΔT of ±2°C across PCB assemblies out to 22” (570 mm) wide edge-to-edge backed by throughput that can still keep pace with your high-volume production needs.
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4-zone Full Convection SMT Reflow Oven
CR4000C
At just over 6 1/2 feet long, the CR4000C full-convection reflow oven fits production areas where floor space is tight without sacrificing performance. High-mass heating panels and high-speed blowers allow the oven to reach temperatures up to 300˚C for lead-free reflow.
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6-Zone SMT Reflow Oven
CR6000
A combination of high-mass heat sources and efficient thermal transfer allows the CR6000 to provide excellent reflow soldering results and throughput with a shorter-than-average heating tunnel. Your 6-zone unit also includes advanced features such as a wide combination pin-over-mesh belt conveyor, partnered pre-loaded KIC Auto Focus profile predictions software, and real-time thermal profiling standard.
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8-Zone SMT Reflow Oven
CR8000
A combination of 8 independently controlled full-convection heating zones (16), 2 cooling zones, and low-velocity, low turbulence air flow allows the CR8000 reflow oven to provide you with thermal accuracy of ±1°C and a ΔT of ±2°C across PCB assemblies to 22" (570 mm) wide. This high-performance model takes up less floorspace than comparable alternatives on the market and offers a throughput that can keep pace with even high-volume production requirements.
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Software
Interface Analysis
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Precision Shunt Chip Resistors
SMV
*5W permanent power at 65C*High pulse power rating*Mounting: Reflow and wave-soldering
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SMT AOI
All MVP products have the unique ability to be deployed in all inspection scenarios from Paste to Post Reflow without changing hardware, allowing maximum utilization of your investment. With Versa, Selecta, Spectra and GEM Platforms, MVP provides the AOI solutions to meet your production requirements.
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Reflow Simulator & Warpage Measurement System
SRS-2
Observe and measure the curving and warping of electronic parts and boards due to thermal stress, using actual reflow conditions.
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Preconditioning
Preconditioning is performed prior to package level reliability testing to simulate the effects of board assembly on non-hermetic devices where moisture may have been absorbed during normal storage. The subsequent exposure to high temperature during infra reflow assembly can cause internal damage such as “pop corning” and delamination.
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Datapaq Reflow Tracker System
Monitor the temperatures for every soldering application – including wave, reflow, vapor phase, selective and rework stations – in real-time with the Datapaq Reflow Tracker Systems. Ideal for the electronics manufacturing and semiconductor applications.
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Oven Performance Checker
OvenRIDER® NL 2+
Regardless of the recipe and what your oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANTLY different. Achieve convection reflow oven Verification by separating zonal temperatures from convective heat flow efficiency while verifying conveyor speed for a true picture of oven Lead-Free performance consistency.
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5-Zone Lead-Free Convection Reflow Oven Includes Pin-Over-Mesh-Belt Conveyor
CR5000
The CR5000 full-convection reflow oven provides consistent, quality performance, low ΔTs across every board, and mid-volume throughput, all in a compact, floor-space-saving footprint. The oven also provides flexibility and easy setup and changeover, thanks to the generously sized pin-edge and mesh belt conveyors, easy to use oven management software, and easy profile setup with the included KIC Auto Focus profile prediction software.
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Moisture Resistance
IPC/JEDEC J-STD-020D.1
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding package damage ”cracks and delamination” from the solder reflow process. This document describes the standardized Moisture Sensitivity Levels (MSL) of floor life exposure for moisture/reflow-sensitive SMD packages along with the handling, packing and shipping requirements necessary to avoid moisture/reflow-related failures. Companion documents J-STD-020D.1 and JEP113 define the classification procedure and the labeling requirements, respectively.
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Reflow Soldering Machines
Shenzhen Leadsmt Technology Co.,Ltd
Used to attach surface-mount components to printed circuit boards (PCBs). It involves applying solder paste to specific locations on a PCB, placing the components on the paste, and then heating the assembly in a reflow oven.
