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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Easy3DMatch
Align a scanned 3D object with another scan or with a reference meshCompute the local distances between 3D scans and a golden sample or reference meshDetect anomalies such as misplaced features, geometric distortions, gaps, bumps,...Compatible with all 3D sensors that produce point clouds, depth maps or height maps
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Optical VisionInspection System
NIDEC-READ's inspection systems serve to locate open/leak circuits on printed substrates forming different conductor patterns within inner/outer layers. These vision inspection systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on them.
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Probe Card
VS Series
Japan Electronic Materials Corp.
*Vertical contact Probe Card with Spring*Suitable for Area array Bump Test
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Solar Cell Backside Printing Surface Inspector
7213-AD
Defects causes by back-side printing process of C-Si PV cells will also cause performance, reliability impact. Among all the back-side printing defects, bumps caused by improper printing may cause high cell breakage rate during lamination of c-Si module process.
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SparkFun RedBot Sensor
Accelerometer
The Accelerometer sensor is an add-on for your RedBot that provides bump and motion detection. The sensor works by measuring acceleration forces on the x, y, and z axis. By measuring the amount of acceleration (or lack there of) your robot can get a better understanding of its movements.
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Test System Design & Manufacturing
Quality systems designed and developed quickly, with minimal bumps in the road and a highly experienced driver who will make sure you don't even feel them.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Analysis
External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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ArgoBot Kit
ROB-00001
The ArgoBot Full Kit is a fully assembled robot and controls development platform. It is based on the Digilent chipKIT WF32(TM), a WiFi enabled development platform, and configured for LabVIEW targeting. Most importantly ArgoBot was designed with FIRST Robotics Competition teams in the front of our minds! Named after the FRC Team 1756 mascot, Argos, the ArgoBot development platform includes a fully-assembled, ready to drive mini WiFi enabled robot (about 8" x 5" x 4"), as well as tons of FRC controls tutorials and example code (LabVIEW VIs). Features included on the ArgoBot will look very familiar to anyone who has worked with National Instruments products (Compact RIO and RoboRIO) in the past. This includes three 5V Digital I/O modules (with jumpered pull-ups), three 5V analog inputs, and an I2C header. Example VIs have been streamlined to enable a 1-click configuration style to accelerate your development process. We also added a 2-channel motor driver that is used to supply the ArgoBot drive motors. Our ultimate goal is that everything you can build, control or implement on ArgoBot can be easily leveraged on your FRC bot! Complimenting its many electrical features, ArgoBot is easy to work with and easy to maintain. The chassis is a polycarbonate (the extremely tough stuff that is easy to drill and modify but easily takes bumps and bruises without cracking) case that is fully intact - meaning that ArgoBot doesn't just come with a case... it is a case! Clean-up and organization is simple - just close the case and turn off the power switch.
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Bump Tester
KD-163
King Design Industrial Co., Ltd.
*Comply with IEC-68-2-29 testing specification(10g/ 16ms、15g/6ms、 40g/6ms、100g/2ms).*Easy installation and simple operation; Low noise; no maintenance required; function holds long.*Well-designed and no resonant-structure, air anti- vibration pad can effectively isolate floor vibration.*Accelerometer adopts repeated measurement and adjustable half-sine wave generator; to control the data is precise.*Magnesium alloy platform is anodized, Servo motor cam to drive, and can adjust the frequency automatically.*The adjustable acceleration value and shock domain is patent design (1ms-13ms).
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IC Test Services
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Director's LCD Monitor with Wireless RF Link
EZ-ROAM D
The highly portable "EZ-ROAM D" has been designed for life on the road, and is ruggedly constructed in an extruded aluminium case sealed to IP67, and tough enough to take every day knocks and bumps. Battery powered (and with an external dc input too), the EZ-ROAM D with it's 7" LCD provides robust diversity radio reception, whilst the recessed controls offer selection between video inputs, 16:9 or 4:3 aspect ratios, Horizontal & Vertical flip, and stereo audio monitoring. There is even an RX OP on BNC.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Compact Bump Gas Solution
Eco Bump
Teledyne Gas & Flame Detection
Importantly, bump testing is the only way to validate that gas detectors will respond to gas and trigger user alarms.Simplified configuration (no software).Measuring only 7.2” (180mm) in height (including the push button regulator), the pocket-sized EcoBump can easily be stored and transported with minimal shipping costs.With 5.5L of bump gas capacity, EcoBump provides approx. 250 bump tests from a single cylinder making it our most cost effective bump solution.
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Auto Bump/Calibration Station
PS500
Teledyne Gas & Flame Detection
To provide accurate performance and results, the PS500 has to be properly used and maintained. The Auto Bump & Calibration Station (ABC) provides bump testing, calibration and data management options and is compact, robust and intuitive to use.Two versions of the ABC are available allowing either a single gas cylinder or up to three cylinders to be connected. Additionally, a special three cylinder version is available for reactive gases.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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330 System
NSX
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Advanced Packaging & TSV
FilmTek 2000M TSV
Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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Bump Test Machine
Labtone Test Equipment Co., LTD
Bump test systems for electrical products repeating impact testing during transportation
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Shock Test System
Labtone Test Equipment Co., LTD
Products are inevitably affected by impact, bump, free fall, tumbling etc. during production, transportation, loading and unloading as well as during the use of the products. All of these are transient excitation on the object, causing the object to produce mechanical characteristics of high speed, acceleration, strain rate instantly. These kind of characteristics are completely different from that in static load, and may cause problems to the object in terms of structural strength and stability and sometimes the object may fail. Therefore, it's necessary to study the effect of impact and reproduce the shock environment, to assess the structural strenghth and performance of the object under shock environment.
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Vibration Testing System
Torontech is now offering Vibration Test Systems, Shock Test Systems, Bump Test Systems, Drop Tester, and Packaging Transportation Simulators.
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G3 System
Dragonfly
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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Environmental Test Chamber
Labtone Test Equipment Co., LTD
Environmental test system, Electro-dynamic Shaker, Shock Test Systems, Drop Tester, Bump Test Systems, Combined Environmental Test Systems
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Shock/Bump Multifunctional Tester
DP-201
King Design Industrial Co., Ltd.
Shock or bump test mainly simulate the impact effects of product and its components encountered in usage and transit process. Through standard and high-reproducibility instant energy exchange, you can analyze the product ability to tolerate the strong external stress and the degradation of structural weaknesses to quickly obtain the data of structure strength, anti-shock appearance and anti-drop. Shock tester is one of destructive experiments, and do destructive test on the product to evaluate the product reliability and monitor the consistency of production line.
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Shock Tester
DP-1200
King Design Industrial Co., Ltd.
Shock or bump test mainly simulate the impact effects of product and its components encountered in usage and transit process. Through standard and high-reproducibility instant energy exchange, you can analyze the product ability to tolerate the strong external stress and the degradation of structural weaknesses to quickly obtain the data of structure strength, anti-shock appearance and anti-drop. Shock tester is one of destructive experiments, and do destructive test on the product to evaluate the product reliability and monitor the consistency of production line.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Automatic Optical Cell/Wafer Inspection System
7200
Among several factors for PV to achieve grid-parity, Reliability of the PV Modules plays an important role. Since its known that some of the cell defects such as edge chips/ flakes, bumps of cell surface were proved to be source of infant mortality of the c-Si PV modules, therefore, to detect those defects is very important for c-Si cell manufacturers.
