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- Pickering Interfaces Inc.
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PXI Medium Density Switch Matrix Modules
Pickering's range of medium density switch matrix modules is a cost-effective solution for applications that require mid-range matrices in the PXI format. Selected modules are supported by our Diagnostic Test Tools, Built-In-Relay-Self-Test (BIRST) and eBIRST Switching System Test Tools, these tools provide a quick and simple way of finding relay failures within LXI, PCI and PXI switch systems.
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Failure Analysis
Failure Analysis
Capabilities of Tandex Test Labs are extremely important to support our in-house manufacturing efforts and are also available to analyze customer component and equipment problems. Techniques and equipment utilized in providing our Destructive Physical Analysis capability are also used effectively to analyze failures, determine failure causes, and recommend corrective actions.
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Failure Analysis
Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Failure Analysis
A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Failure Analysis Testing
When a product or device fails, you need to know why. Root cause failure analysis helps a business get to the source of a product failure. More importantly, it provides the manufacturer with the information needed to address and correct the issue causing the failure.
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Failure and Technology Analysis
Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis Services
Introducing our Failure Analysis services partner, close neighbour and collaborator NanoScope Services. Working together with NanoScope we offer the following portfolio of advanced FA services.
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Battery Failure Analysis
compact manually-operated machine for disassembling cylinder cases in the battery R&D lab. The compact body design allows easy operation inside a glove box to preserve & prevent the electrolyte and active materials from contamination during case disassembling. Simple operation with a safety protection cover allows customers to master the disassembling procedure within 5 minutes.
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Fatigue Failure Tester
EKT-2002FF
EKT-2002FF Flexing Fatigue Tester is designed in accordance with ASTM D4482 to test the fatigue life under a tensile strain cycle on different kinds of vulcanized rubber compound to determine the fatigue life at various extension ratios.
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Electronics Failure Analysis (F/A)
NTS electronics failure analysis capabilities can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices as well as materials and assemblies.Electronics F/A can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a F/A should be performed to identify the root cause of failure. The information presented in the root cause F/A will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased F/A performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products.
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Benchmark, Competitive and Failure Analysis
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Electronics Failure Analysis System
Sentris
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Root Cause Failure Analysis
Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Failure Analyziz and Quality Assurance
NX20
There's no room for error in the data provided by your instruments. Park NX20, with its reputation as the world's most accurate large sample AFM, is rated so highly in the semiconductor and hard disk industry for its data accuracy.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Materials, Structure, Surface, and failure analysis Services
Materials Analysis Technology Inc.
MA-tek provides wide span of materials analysis, structure analysis, surface analysis, and failure analysis. By technology segment, MA-tek provides 9 major service lines:1. Electrical Failure Analysis (EFA). 2. Physical Failure Analysis (PFA). 3. Structure Analysis. 4. Surface Analysis. 5. FIB Circuit Editing6. Reliability Testing. 7. Reverse Engineering of Benchmark Analysis. 8. IP Consultancy. 9. Quality Management Training Course.
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PCB Failure Analysis: Identification and Testing of Defects
From cheap toys and smartphones to sophisticated computers and radar detector systems, printed circuit boards (PCB) are critical components for today’s electronic and industrial technology. Almost every electronic device has one of these self-contained modules of complex interconnected electronic components, which include resistors, capacitors, transistors, diodes and fuses.
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Destructive Physical Analysis (DPA), Failure Analysis (FA), and Counterfeit Analysis of Electronic Components
Destructive Physical Analysis (DPA) is the process of disassembling, testing, and inspecting electronic components to verify the internal design, materials, construction, and workmanship. This process of sample inspection is used to help ensure that electronic components are fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for identification of production lot problems.
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Battery Tester
BAT-200
Check the batteries! Battery failure is often the common cause for the sensor or instrument failure. Simple to use, portable universal battery tester for the standard and rechargeable batteries.
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Diagnostic Test System™
The original Teseda system for bench-top stimulus, test pattern debug, validation, device failure mode stimulation in-situ with other Failure Analysis lab equipment such as an EMMI, etc.
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Custom Test Design
Materials Evaluation and Engineering
Some problems require solutions beyond the standard test methods and procedures routinely performed at MEE. Replicating the suspected cause of failure on an exemplar part can provide valuable information about the likelihood of that failure case. Likewise, intentionally causing component failures in a variety of ways can provide insight into possible failure scenarios. Wondering how (or if) a design or part can be tested? Give us a call – the engineers and technicians at MEE enjoy the hands-on experience of designing customized testing plans for your unique challenges.
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Network Management
BLASTGUARD
BLASTGUARD mitigates against the effect of Underground Distribution Box (UDB) failures by safely absorbing and dispersing the kinetic energy, while protecting against the heat energy from an explosive failure.
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Power Monitors
The Monitor family includes a range of products that not only measure power and VSWR but also provide hard contact alarms to protect your system in the event of a system failure – the IP-enabled, BPME is even capable of emailing a failure notification.
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Winding Resistance Tester
JYR20S/10S
DC winding resistance testing is regarded as another essential routine screening tool. It indicates problems such as loose, defective or incorrect connections, which cause enough transformer failures each year to be regarded as a failure category of its own.
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RF Power Monitors
Bird's RF Power Monitor family includes a range of products that not only measure power and VSWR but also provide hard contact alarms to protect your system in the event of a system failure – the IP-enabled, BPME is even capable of emailing a failure notification.
