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- Scientific Test, Inc.
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Automated Discrete Semiconductor Tester (ATE)
5300HX
The Model 5300HX Automated Discrete Semiconductor Tester (ATE) is designed for fast, reliable testing of a wide range of discrete devices. Using an on-board Intel SBC, can provide stand alone testing capability or connected to a PC for intuitive test development and data capture.
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Intel Systems
NextComputing appliances and Intel processors are both built at the boundaries of technology and make amazing experiences possible. Leverage these combined solutions to customize your ultimate solution for professional grade computing at lightning speed.
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Intel Architecture SBCs
Using state of the art Core and Xeon Technology, over 20 single board computers deliver you performance and flexibility-with easy upgrade guaranteed.
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Intel 80486 DX4
MS 1502
- ATE- Data Acquisition System- Process Control Industry- Industrial Automation
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Intel® SDM Large
Intel® SDM Large measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra slim displays. The Intel® SDM–L is optimized for digital signage, interactive flat panel displays, interactive touch computers, video walls, etc.
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Intel® SDM Small
Intel® SDM Small is 60 mm x 100 mm with a maximum thickness of 20 mm, so it can easily slot into ultra-slim displays that require minimal space with maximum performance.
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3U cPCI Intel SBC
75INT2
NAI’s 75INT2 is a 3U cPCI Intel® Core™ i7-based, Single Board Computer (SBC) that can be configured with up to two intelligent function modules and delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.NAI's Intel® Core™ i7 SBCs in the 3U cPCI form factor offer improved processor performance and better security, targeted at military and defense applications such as manned and un-manned air and ground vehicles, and in more sophisticated digital signal processing applications such as intelligence, surveillance, reconnaissance, radar and sonar.
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Intel x51 Based Boards
MS 1507
- General Purpose I/O Signals- RS232/422 Interface- External Bus, External Interrupts
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High Performance Intel Mission Computer
ComSys-5363
The ComSys-5362 is a rugged COTS mission computer. A server grade Intel Core™ i7-7820EQ Xeon E3 CPU supports signal processing for critical applications. Highly configurable, application-specific I/O. Removable drive bay for two 2.5“ SSDs.
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Intel Xeon D-15xx Processor, AMC
AMC763
The AMC763 is a Processor AMC in a single module, mid-size, based on the Intel® 5th generation Xeon 4-core, 8-core or 16-core Processors (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Intel 80486 DX2 Processor Board
MS 1500
- PC 104 bus and ISA bus interface- Facilitates design of scalable architectural solution for Embedded System- Back plane eliminated by self-stacking PC 104 bus- Substantial reduction of development time, cost, as well as risk- Helps to Faster time-to-market / timely product productions- Used for LCA Simulation Project- Intel 80486DX2 @ 33MHz- 512Kbytes of STATIC RAM, 2048 Kbytes of FLASH PROMS- 64 Kbytes of DPRAM- External Interrupts- RS232 Serial Interface- Watchdog Timer- External Bus Interface
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Intel® Smart Display Module Small (Intel® SDM-S) With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
SDM300S
The SDM300S is a signage computer module following the newest Intel® Smart Display Module Small (Intel® SDM-S) architecture. The SDM300S is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake) with the Intel® HD Graphics 505 or 500 chipset. The sleekest all-in-one display module measures only 100 x 60mm (roughly the size of a credit card), which makes for a thinner display. The SDM300S can be easily connected to an SDM-compliant display via a high-speed PCIe edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 1.4, DisplayPort 1.2, Serial TX/RX and I2C signals. Nearly a third the size of Open Pluggable Specification (OPS), the design of the SDM300S omits housing so it is well suited for space-constricting applications.
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Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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PC/104-Plus SBC with Intel E3800 CPU
ARIES
The Aries PC/104-Plus single board computer from Diamond Systems uses the Intel “Bay Trail” E3800 series processor to deliver an unmatched combination of performance, price and power consumption. Packed with real-world features, Aries provides a complete solution for most embedded applications in a single board, saving you space, time, and money.
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COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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Intel 186 EB & EC Processor Boards
MS 1503
- ATE- Data Acquisition System- Process Control- Industrial Automation
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COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175
CEM510
The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
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Thin Mini-ITX Embedded Board with Intel Atom®
AmITX-AL-I
The AmITX-AL-I is a low-profile Thin Mini-ITX embedded board supporting an Intel Atom® processor E3900 series, Intel® Pentium® processor N4200, and Intel® Celeron® processor N3350 system-on-chip (SoC). The AmITX-AL-I is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Customized Solutions Based On Intel® RealSense™
The Intel® RealSenseTM stereo depth technology is what you need, but the form factor or features of available solutions does not fit the requirements?
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CPCI/PICMG 2.16 4th Gen Intel Core Processer
CP6005-SA
The CP6005-SA 6U CompactPCI processor board available with Fourth Generation Intel® Core™ Quad Core processors meets the outstanding computing and graphics performance requirements at lowest power budgets.
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FRAMOS Cameras With Intel® RealSense™ Technology
FAMOS D400e
The D400e products from FRAMOS bring state of the art Intel® RealSense™ stereo depth sensing technology into the industrial environment. The series offers full bodied IP66 rated cameras, and board level modules for easy and flexible integration into your design.
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Intel® 5th Generation Xeon Processor, AMC
AMC752
The AMC752 is a Processor AMC in a single module, mid-size based on the Intel® 5th generation Xeon (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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11th Gen Intel Xeon Compact PCI Blade
CP6007-SA
CP6007-SA is based on 6-core or 8-core 11th Generation Intel® Xeon® processors with 10nm technology, with outstanding performance-per-watt values. Its scalable power budget allows users to tailor the power dissipation to their requirements. 32GB soldered memory and the option for an additional 32GB SODIMM with ECC is provided.
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Intel Xeon E3 Processor AMC, PCIe Gen3
AMC758
The AMC758 is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Intel Xeon E3 Processor AMC, PCIe Gen3
AMC756
The AMC756 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Intel Xeon E3 Processor AMC, SRIO Gen2
AMC759
The AMC759 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® Xeon® Processor E3-1505M v6 (Kaby Lake) with CM238 PCH. The processor base frequency is 3.0 GHz with max turbo frequency of 4.0 GHz. The module follows the AMC.2, AMC.3 and AMC.4 specifications.
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Compact PCI Intel Xeon D Server Blade
CP6006-SA
CP6006 is a server class CPU platform, designed and produced in Germany. CP6006 is based on the 14nm technology Intel® Xeon® D-1500 processor with 8 CPU cores (options 2–16 cores), with excellent performance-per-watt values. Its scalable power budget allows users to tailor the power dissipation to their requirements. CP6006-SA provides cooling mechanics for standard air cooled systems.
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CPCI/PICMG 2.16 Intel Core 17th Gen. System
CP6004-RA_RC
The CP6004-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.Based on the Intel® Core™ i7 third generation processor and the QM77 platform controller hub, the CP6004-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
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The Intel® RealSense™ Depth Sensing Portfolio
Intel® RealSense™ offers a range of stereo vision cameras and modules, supported by an extensive open-source SDK. The D400 product line helps you ensure that you can add robust three-dimensional vision capability to your products or systems. The cameras feature an integrated ASIC that performs real-time depth calculation directly on the camera, saving you processing resources on the host system. The SDK allows you to further tune the depth data stream to your needs.
