Interposers
interconnect between one connection to another.
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RC BGA Interposer, LPDDR4 200-ball, Rigid, Connects Using 2x U4207A
W6602A
The W6602A LPDDR4 rigid RC BGA interposer for LPDDR4 200-ball DRAM enables capture of simultaneous read and write traffic at data rates and has been tested to 3200 MT/s. Two U4207A zero Ω, 34-channel, soft touch pro, single-ended, 4 x 160-pin direct connect probes are required to connect the W6602A LPDDR4 BGA interposer into two U4164A logic analyzer modules. The W6602A LPDDR4 rigid RC BGA interposer allows signal access to the LPDDR4 signals critical to your debug and validation effort through a U4164A logic analyzer system. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR4 200-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR4 signals.
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Flat Flex Test Fixtures
Z-AXIS Flex Circuit Test Fixtures are used to connect flex circuits to test equipment. 20,000 plus cycles. Using the Z-Axis Elastomeric Connector Interposer, the connection to the OEM FFC connector becomes permanent and is thereby saved from over-use.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF
W6601A
The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.
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DDR4 X16 2-wing BGA Interposer For Logic Analyzers, Connects To 61-pin ZIF
W4641A
The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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PCI Express 3.0 Test Platform with SMBus Support
The Summit Z3-16 Test Platform with SMBus Support allows the Summit Z3-16 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen3, Gen2 or Gen1 hosts and devices. In addition, it supports the Summit Z3-16 with SMBus Support by providing SMBus tapping connectivity.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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DDR3 MSO Probes
The DDR3 DIMM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR3 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR3signals for convenient analog probing.
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VPX Interposer
VPX850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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DDR5 X4/x8 78-ball BGA Interposer For Use With U4164A Logic Analyzers
W5643A
The W5643A DDR5 2-wing BGA interposer for DDR5 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W5643A is the smallest BGA interposers for DDR5 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding up to 5GT/s for protocol analysis and up to 4Gb/s for DQ capture. U4208A and U4209A probe/cables connect any W5643A DDR5 BGA interposer directly into the U4164A logic analyzer module using 61-pin high density zero insertion force (ZIF) connectors that attach to the W5643A BGA interposer wings.
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PCI Express 4.0 Test Platform
The PCI Express 4.0 Test Platform provides a convenient means for testing PCIe 4.0 add-in cards with an internal interposer and power supplies. The Summit Z416 Test Platform provides the platform for the Summit Z416 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen4, Gen3, Gen2 or Gen1 hosts and devices. It supports SMBus and other sideband signals.
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Memory Interposers
Memory interposers for logic analyzers and oscilloscopes are ordered by memory type. Please select the memory type/technology of interest.
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PCI Express 4.0 Protocol Analyzer Exerciser
Summit T416
The Summit™ T416 analyzer is the computer industry's first high speed PCIe 4.0 protocol analyzer that meets the challenge of 16GT/s and up to x16 lane width protocol analysis. Many PCIe 4.0 product designs are already in progress using the PCIe 4.0 specification. Companies are currently working with the Teledyne LeCroy Summit Z416 protocol exerciser for PCIe 4.0 at the deployment of PCIe 4.0 for host system emulation with their testing needs. This combination of a protocol analyzer and exerciser make Teledyne LeCroy the only supplier of protocol test and development tools for PCIe Gen 4. High speed interposers that provide protocol analyzer connectivity to CEM or other form factor sockets on system boards will still continue to be the principle way to capture PCIe traffic into the protocol analyzer.
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DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF
W4643A
The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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PCIe 4.0 Test Platform
PXP-400A
The Teledyne LeCroy PXP-400A Test Platform provides a convenient means for testing PCIe 4.0 cards with a self-contained portable and powered passive backplane. The PXP-400A provides power required for both cards under test, and an interposer can be used for connection to a protocol analyzer.
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DIMM Interposer Probe
FS2361
The FS2361 is a logic analyzer probe used to test DDR3 DIMM memory. When used with the triggering and analysis capabilities of Keysight’s U4154/64 Logic Analyzer modules, it gives the user an extremely effective tool for debugging, testing and verifying DDR3 DIMMs.
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PCIE/NVME Interposers
SerialTek’s PCIe Gen3 Slot (AIC) Interposers with SI-Fi technology are specially designed test adapters that are physically placed in between the PCIe slot and a PCIe endpoint to intercept and relay a copy of the high-speed signaling and discrete data lines to the PCIe Analysis system in real-time.
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PCIe 4.0 Protocol Analyzer
Summit T48
Teledyne LeCroy’s Summit™ T48 joins the Summit™ T416 as the second protocol analyzer to be released in its family of tools supporting the PCIe 4.0 architecture. The new Summit™ T48 protocol analyzer based on the PCIe 4.0 specification supports up to 16GT/s and up to x8 lane width for protocol analysis. Companies that are interested in testing PCIe 4.0 based I/O cards such as Storage Controllers, Ethernet, Fibre Channel, Infiniband, and others will now be able to get all of the protocol analyzer debugging features they need, while being able to better manage their costs. SSD storage applications will also benefit from the integrated support for SSD bus protocols such as PCIe/ NVMe/ SMBus/ NVMe-MI/ TCG and others. When combined with Teledyne LeCroy’s Summit™ Z416 protocol exerciser, the Summit™ T48 will provide a deeper understanding of test results on a variety of test configurations. Teledyne LeCroy’s wide range of high speed interposers and probes provide full flexibility and connectivity to CEM and other form factor sockets on system boards as well as solder down and mid-bus probes.
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Molded Interconnect Subtrate
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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DDR4 MSO Probes
The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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Detective Logic Analyzer
DDR3
Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured StatesContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsRow Hammer Analysis for potential data corruptionInteractions among up to 8 ranks, over two slots are analyzed.Mode Register Listing providedSupports Auto-Clock rate detect and clock stoppage Connects to the target under test with DIMM, SO-DIMM, and BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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Flying Lead Probes
FLP850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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Analyzer Probes
The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
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DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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PCI Express® 5.0 Interposer
OCP NIC 3.0
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
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XMC Interposer
XMC850
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Diode Laser Driver
D200
The D200 is a compact, DC-coupled fast laser driver, providing up to 4 amps of regulated constant current. A built-in edge-triggered pulse generator produces up to 1 microsecond pulse widths and 2 nanosecond transition times, capable of driving lasers with forward voltages up to 9 volts. A pulse-follower mode is also provided, accommodating externally-defined trigger widths up to 100% duty continuous-wave (CW). Power, pulse width, drive current and differential triggering functions are accessible through a ribbon cable header for embedded OEM applications. A low-inductance laser drive interface permits direct laser connection or custom interposer and flex-cable attachment.
